and HBM4 has increased heat dissipation issues and x3 /x4 slower than HBM3 increased noise issues and crosstalk suppression .... technical issues that a 4DS at 20nm can potentially mitigate...
also - smart phone Nand Dram interface slowing considerably due to data volume increases ....again 4DS 20nm is a fix potentially if successful '''and that's just a few compelling applications imo
this is where my interest is focused ...everything else is noise imo
