Having Infineon design and tapeout a photomask in collaboration with imec, specifically tailored for 4DS PCMO Non-Filament IS ReRAM, and handing it over to a top-tier Taiwanese foundry (Top 2 - UMC) for FEOL processing, speaks volumes about our position and the progress being made.
UMC manufacturers chips for many leading and reputable names and 4DS having UMC process FEOL is a major strategic move as it replicates the commercial process.
We now have two industry giants actively involved in the commercialisation of 4DS technology.
4DS secret is finally breaking out.
(20min delay)