You might joke, but, it's worth understanding that Infineon has a global presence (like most global big tech companies). It's also worth understanding that the semiconductor industry is small, and the reram specific industry, is even smaller - some might call it incestuous. Now, look at Ting's credentials over his career (decades) - his worked at some of the biggest semiconductor > memory, related companies in the world. Now finally, understand that the major Infineon facilities in the US, are in SanJose, CA - which is only a 2km walk from our 4DS Fremont facility (have a look). In an Industry so specific as semiconductors, and Reram - people talk, people brush shoulders, people have beers at the same bars. For those who have never spent time working in Silicon Valley, it might seem like a big place, but it's incredibly small.
I have no doubt Infineon has been watching 4DS for years, following their progress with IMEC, and their 2023 PL4 results (or at the very least had awarness of the area based interface switching architecture 4ds has been pioneering - which is unique). Whether Infineon specifically made an approach; or if IMEC in combination with Ting/Pete/IMEC engineers; helped to create an introduction - who truly knows - but as someone who in a past life worked in the valley, I can tell you 4.5mAUD is beyond cheap (it's almost like a 'mates rates' formality). All big tech companies in SJ, and surrounds have entire teams dedicated to keeping abreast of what is happening around them, typically known as 'tech radars'.
It's been a wild journey so far, and I think for the first time, we've actually got a clear, and feasible roadmap to commercialisation. 'IF' 4DS can demonstrate successful function at 20nm, I suspect all the naysayers out there are going to eat their words rather quickly.
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