I would say “the tech (imec’s universal memory vehicle) cannot distribute current uniformly across the entire area of the memory cell”. This limitation stems from interoperability issues between 4DS technology and imec’s universal megabit memory vehicle which is totally normal and expected.
Ting cannot quantify the upper limits of endurance currently rated at 3x10^9. Infineon designing a custom memory vehicle tailored specifically for 4DS memory cells will unlock its full potential.
With regards PL6/20nm, I believe Ting would have never progressed with it if he did not get what he needed from PL5 to successfully execute PL6.
Ting’s recent 20 Million options is a strong indication as to where things are headed.
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