and keep your eye on these guys - test chips in 2026
https://semiiphub.com/news/neo-semiconductor-3d-x-dram
“This innovation pushes past the scaling limitations of today’s DRAM and positions NEO as a frontrunner in next-generation memory.
”Key Features and Benefits:
- Unmatched Retention and Efficiency – Thanks to IGZO channel technology, 1T1C and 3T0C cell simulations demonstrate retention times of up to 450 seconds, dramatically reducing refresh power.
- Verified by Simulation – TCAD (Technology Computer-Aided Design) simulations confirm fast 10-nanosecond read/write speeds and over 450-second retention time.
- Manufacturing-Friendly – Uses a modified 3D NAND process, with minimal changes, enabling full scalability and rapid integration into existing DRAM manufacturing lines.
- Ultra-High Bandwidth – Employs unique array architectures for hybrid bonding to significantly enhance memory bandwidth while reducing power consumption.
- High Performance for Advanced Workloads – Designed for AI, edge computing, and in-memory processing, with reliable high-speed access and reduced energy consumption.
DRAM space is getting interesting![]()
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