Blast from the past - thanks for sharing (brings back some...

Blast from the past - thanks for sharing (brings back some memories). It's exciting that 6 years on, we have been through many of these 'flip doors', and are on the precipice of scaling to 20nm; then creating a full fledged chip with industry leaders Infineon, IMEC and Tier 1 fab. This is certaintly pushing the boundarys of materials science and engineering - truly novel technology being area-based reram. I'm sure Guido is watching on closely.

I think i've shared this one before, a research article out of IMEC a few months back (not sure if this is a red herring, but it sounds very familiar). https://www.imec-int.com/en/press/imec-demonstrates-electrical-yield-20nm-pitch-metal-lines-obtained-high-na-euv-single