4DS - Anything but Charting, page-3837

Sorry nateOstrike to disappoint you but falling on face is out of question at this late stage of development of 4DS Memory. ALL iterations are done succcessfully the wafers are backed to the best physics and technology available- no more questions to be asked about manufacurability (fab) of memory wafers anywhere on the same 300mm mashines around the world. The only obstacle is for extreme achievement of MB chip and its testing.That's not falling on face my friend- that's a road to victory of this elegant NON filamentary ReRAM witch uniqueness gonna dominate the decades to come...