4DS - Anything but Charting, page-480

its definately something they should have addressed already. No point doing a production fab qualification if your not 100% sure that it can all be put together into a chip.
two scenarios are likely to me;

1. as Hash has implied they have already done testing with their lab produced cells/wafers. though there is no mention i can see from 4DS that this has occurred.
2. IMEC is working with a few different companies on Reram solutions. im sure they have used their 1mb test vehicle on similar designs and are confident it will work and have the data to prove it.