4DS - Anything but Charting, page-516

imec Timeline

1st November 2017 - imec collaboration announced.
????????????????? - fabrication of 1st wafer batch begins.
????????????????? - fabrication of 1st wafer batch complete.
20th September 2018 - analysis of 1st wafer batch complete.
????????????????? - fabrication of 2nd wafer batch begins.
31st January 2019 - fabrication of 2nd wafer batch complete.
20th February 2019 - analysis of 2nd wafer batch complete.
2nd April 2019 - fabrication of 3rd wafer batch begins.

Despite the missing dates, it's clear they've significantly decreased development cycle duration. Next announcement that fabrication of 3rd wafer batch complete shouldn't be far off. I'm guessing they'll need two more iterations before writing the cook book and baking the taster cakes. This seems possible within the year as they keep reiterating. Also, the remaining patents should be approved in the near future and within the year. The 4DS Memory functional megabit chips, cook book and full suite of intellectual property should be packaged up and on the market this year. And if it's as disruptive as expected, it'll be like throwing a chip in the air at the beach.
Glad I'm holding.