AKP-capital raising, page-48

Just found how to do this properly. The images below are mainly generic for semiconductors, rather than MEMS, but you'll get the idea.

Wafers are the thin silicon sheets cut from a silicon ingot. They lookalike CDs. Electronic circuits and MEMS devices are built on their surfaces, layer by layer. Each wafer contains multiple identical devices (dies or dice). When construction is complete the devices on the whole wafer would be tested for functionality, then the devices are cut off as individual silicon dice or chips. These are then integrated with any auxiliary devices (such as an ASIC) and connections established between the silicon device and its external metal contacts.



Not every die is perfect, so the yield depends on the design and production processes. A robust production process is dependent on well designed process steps. A good design and good fabrication process ensures good functionality and durability.