Ann: 4DS Australian Open Briefings Presentation, page-298

We all understand that is fast extremely low power consumption no need for error correction etc...but this things has to be incorporated into a complex PCB which is part of even more complex data centre unit. The manufacturing process of any surface mount chip is done with solder bath 250++ Celsius. The same chips sometimes heats up enormously CPU-s require serious cooling. So we just cannot embed 4DS memory onto ANY CPU/GPU unless can withstand extreme temperatures (much higher than ICU engine-somebody mentioned earlier). And have to be perfectly operational/funktional for characteristics engineered ....