can i ask anyone here, because i have just re read the announcement, and what catches my attention is the extra work done on imec machinery with the 3rd batch. Is this sort of saying how it will work on other devices.
I have no idea if thats what it is saying,i sort of see it that way but does anyone else see it that way. I could be reading too much into it or got it wrong like i do.
Ann: 4DS receives imec wafers, page-65
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