Logic design for the Akida device has been completed and the development is now in synthesis and physical design. Verification, package design, test hardware and software development will be completed in parallel with physical design and wafer fabrication.
The Company expects to begin wafer fabrication within the coming months and provide engineering samples in early calendar year 2020. Costs associated with the developmentand manufacturing of the Akida device are included in the Company’s budgeted expenses for the December 2019 and March 2020 quarters.
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