You're right Bob, nothing too exciting about this release. The only positive I see is in the paragraph:
"The combination of both demonstrations provides critical and verifiable indicators that enables the
company to intensify its engagement with the marketplace, a process that is already underway".
This was said before but they seem to reiterate it with slightly more conviction. This reflects on the confidence the Board has on the final product.
I feel your first paragraph however, relating to rapid aging of the chip over only a few days, is a concern. Is it to do with oxidation,electrostatics or mechanical wear? Will the silicon layer protecting dust and shocks be enough to address this issue I wonder. Hopefully whatever the cause is, the answer could be in the packaging?
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