Ann: Appendix 4C - quarterly, page-9

"Is it to do with oxidation,electrostatics or mechanical wear? Will the silicon layer protecting dust and shocks be enough to address this issue I wonder. Hopefully whatever the cause is, the answer could be in the packaging?"

They have previously said the electrostatic problems have been solved. Also, the MEMS has been proven to work error-free for more than a trillion cycles. Thus I feel we can rule out all but a potential oxidation issue which should be fixed by the protective layer that is applied during packaging.

AIMO