nah sorry mate.
After a decade in development they would have figured out about 5 years ago if this was not going to integrate with a memory platform.
And like we're aware, the hard part is the cell design and physics.
The super glueing to the memory platform PCB is the engineering challenge that has been done a thousand times at imec.
I still cannot see a realistic bear case where the technology suddenly falls over at the last hurdle.
Ann: Appendix 4D & Half-Year Financial Report, page-41
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