This is where they take the ASIC and MEMS chip put them together...

This is where they take the ASIC and MEMS chip put them together and find they don't work and then set about fixing the defects and design flaws. In other words, bug fixing.

Much has been said, all approvingly, about how AP are working to perfect the production ready chip before demonstrating to potential customers. There is a huge risk here. It may turn out that the specifications of the chip do not meet the real world requirements of the devices that may use them. After the first demonstration they may need to go back and redesign the package to suit what the customers actually want.