Ann: Audio Pixels Integration Stage Update, page-40

My understanding is there are 2 MEMs vendors (Sony and Tower Jazz), plus the ASIC vendor.

There is also a 3rd vendor as discuss in announcement 30 May. I believe at the AGM they mentioned a novel cleaning process is required to remove any contaminants (less a pixel gets jammed) and this vendor provides this.

I assume they also have been working on the points of contact process with that vendor and have now developed a version suitable for production. That vendor will receive MEMs wafers and deliver cleaned MEMs chips with contacts.

My understanding is that AKP will do a cap raise to build a facility to do the final assembly and testing. So, I assume they will take a finished MEMs chip (including contacts) and connect it to the ASIC and that white membrane shown at the AGM to form a final device. I also assume this will be done manually initially to provide a batch for demonstration since no production facility currently exists to assemble an AXP device.