AI1’s interconnect promises to improve the performance of chips by solving an industry wide problem of the copper/aluminium interconnect reaching scalability limits.
Nvidia, intel et al cannot create the next generation of chip without a solution because copper & aluminium have performance and heating issues if too much compute is processed at ultra-thin levels inside the chip.
That is why Nvidia chose to collaborate with 2DG/AI1 via the ConnectingChips program to design the future chip!
https://www.theaustralian.com.au/business/*/news/look-beyond-us-megatechs-these-undertheradar-asx-tech-stocks-surged-in-2024/news-story/4f0a0c37998531107f6fd58e0b0cdd5b?btr=64f71c31bc3b75af7fe7804668e3b444
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