Here is a link to a very interesting illustration of what happens in a FAB that was recently posted by @JustLee on the WBT thread, so my thanks go to him for providing the link.
https://hotcopper.com.au/posts/74533734/single
I just saw this link on WBT. It is probably the best explanation and illustration of how a FAB works I've seen. Really helpful for anyone unfamiliar with the semiconductor fabrication industry and processes. I think it helps us if we have some grasp of this to appreciate the issues AKP is facing and the reasons behind the long time lines and delays we have had to wait to get things done. AP's MEMS is similar but different, (and definitely not computer core chips!) but the differences are only emphasised by the essential stuff shown here. MEMS uses many of the same processes, tools, and steps, but are probably more difficult to make than 'simple' chips because of the creation of moving parts and empty spaces from those same processes. With MEMS I imagine that in-process testing would not be able to indicate the proper movement of those components doing what they will ultimately be required to do. I remember Danny Lewin saying that the AKP MEMS chip involved around 500 process steps.
Even at around 30 min it is very worth watching. Enjoy!
https://youtu.be/dX9CGRZwD-w?si=H_2PUOtv0mjWfb2j
GLTAH
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