AKP (ASX) Ann: Continued Suspension from Quotation

Originally posted by BobF: ↑

I think the June in question was last June. There have been many references to the 'chips' having being expected towards the end of 2023. No packaging plant -> no 'chips'. We have seen images of Danny Lewin and Yuval Cohen cutting ribbons at the opening ceremony of this packaging plant. In the recent 4C for Dec 23 this was reiterated, with chips first being expected in Q1-24. While we have gone past this timeline (again) this outcome is still only possible if EM can package the finished dies from approved wafers into chips. So again: no packaging plant -> no chips. It is feasible that the packaging could be done elsewhere, but that is not what we have been repeatedly told by AKP.

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Here it is:

http://m.emems.com.cn/cn/col.jsp?id=103

Encapsulation factory
The factory is located in No. 12, Changshu Shenggu, Suzhou, a beautiful Jiangnan city. The factory is a production workshop designed according to the high standards of the international packaging factory. At present, the total investment of the first phase of the automatic sealing and testing line is 120 million yuan. The factory has a dynamic thousand-level clean workshop of 2,000 square meters, with a total annual design production capacity of 40 million B GA MEMS Speaker, the first phase of which has a production capacity of 10 million BGAMEMS Speakers. The first phase has an automatic packaging line based on the supporting production of the Speaker unit. The existing sealing and testing equipment comes from internationally famous brands such as ASM, BESI, KS, FUJI, TSK, etc. The processes involved include DB, WB, SMT, COATING, LaserMarking, Balling, Sawing, Film Mounting, etc.

The members of the company's sealing and testing team come from international acoustic and packaging factories, including Knowles, Samsung, Sun and Moonlight, Nantong Fujitsu, Changdian and so on. The team members have an average of more than ten years of packaging engineering experience. The company has strong independent packaging technology development ability and process quality management ability. The factory has begun to apply
[ Please lay out the relevant packaging patents. ]
The factory has an
Engineering laboratory - which can carry out thermal simulation, stress simulation, failure analysis and packaging process verification of various packaging designs;
Reliability laboratory - can test the long-term reliability of high and low humidity and thermal cycle impact, vibration, high temperature storage, waterproof grade, salt spray, etc. of products;
Acoustic laboratory - can carry out various Field testing of acoustic products.
With the continuous development of the company, we will upgrade the laboratory capacity to meet the standards of IEC17025 National Laboratory in the future to meet the development and testing needs of future products.
©2023 Earth Mountain (Suzhou) Microelectronics Technology Co., Ltd. All rights reserved Su ICP No. 2021041361-1
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Of course, I accept that this could all be faked by an organisation designed to hoodwink gullible shareholders in Australia. But incredible due diligence seems to have been taken to make everything look so real. Some things you just couldn't make up! Amazing attention to detail.
I just hope there are no identifiable people associated with this faked company known to the Australian authorities. Oh wait, could it be that every body already knows who is involved? How smart is that? How do they think they can possibly get away with this?

Gee. I can't wait to see how it all turns out.