Ann: Demonstration of GEN I speaker from AGM presentation, page-68

The 50 million per year capacity limit is the EM packaging facility capacity. Although, from previous comments, I think that the actual capacity might be slightly less than that.

EM do not own any fabs. they outsource the fab work.

By having 2 x 8" wafer fabs working on the pre-production Gen 2 chips as well as the 6" fab helps increase potential capacity by bringing these fabs up to speed on the fabrication techniques and also decreases the per chip cost since 8" wafers yield about 2 x the chips c/w a 6" wafer.

The bottleneck will then be packaging unless EM increases capacity or outsources packaging as well.