The following was presented at the EGM, which didn't sound ambiguous...
Next Steps
- Delivery balance of development wafers during January/February
- Complete testing and algorithm adjustment and introduce / demonstrate music play
- Complete last process steps to allow chip packaging
- Engage fabricators in transition to mass production
I guess they accidentally forgot to include the bit about it being highly likely that there'd be deficiencies in the new process which would require a new round of manufacturing and testing.
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The following was presented at the EGM, which didn't sound...
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