The following was presented at the EGM, which didn't sound...

The following was presented at the EGM, which didn't sound ambiguous...

Next Steps

- Delivery balance of development wafers during January/February
- Complete testing and algorithm adjustment and introduce / demonstrate music play
- Complete last process steps to allow chip packaging
- Engage fabricators in transition to mass production

I guess they accidentally forgot to include the bit about it being highly likely that there'd be deficiencies in the new process which would require a new round of manufacturing and testing.