Ann: Digital Speaker Development Update, page-23

so here's a question... 1 vendor dices ( let's call them vendor 1) and another joins the asic to the wafer ( let's call them vendor 2). does a third vendor put the sliced chips with the combined asic and wafer into the protective housing that stops the chip getting corrupted?

if so, i wonder how the chips are safely transported to that hypothetical 3rd vendor.

also, if demo ready chips are arriving this week, with more to follow, do they wait for all chips to arrive before doing the demo, or do they do the demo without all the other chips arriving?

obviously these are questions for the company itself, but I'm hoping they're too busy to answer such questions