A well made recording would be an improvement on what we heard so far where the audio samples have had a lot of noise but they need to put the 'working' chips in the demo boards first.
We will be lucky to get something by the AGM. They have to get the packing process sorted out first and only then will they risk the latest chips. Each time they report they describe new issues that we were not aware of before. From the announcement:
'Nonetheless despite all these limitations the demonstration systems work as intended, and will continually improve in the coming weeks as the packaging process is optimized and we begin to introduce newer generations of MEMS dies into the chip packaging process.'
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