Q4 2018 "signed an equipment lease agreement with government...

Q4 2018 "signed an equipment lease agreement with government platform" and then "wafer tape out."

2019,20,1st half 21 - "wafer process flow finalization"

Q3 2021 Start r&d for packaging. They then rapidly set up an automated packaging process because all the work had already been done by AP and the German packaging company.

So for 2 and a half years they were developing the process of mass manufacturing chips with equipment leased with government support. Perhaps utilizing the facilities of other more established vendors within China.