so the "lower latent heat component" is being changed to a "new latent heat solution"?
Lower than that of Silicon? (has the highest latent heat of fusion known to man)
Has GAS TESS been using something other than silicon? (eg .... lead?)
"new" fails to clarify whether the next design will increase or decrease the latent heat capacity.
Report just mentions 1500degC biogas input temperature (necessary to pump heat energy into silicon already at its melting point of 1414degC)
Typical ambiguous reporting from this company.
i smell a coverup
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