From reading the discussion in the patents I don't think it is...

From reading the discussion in the patents I don't think it is at the level of the ASIC that the adjustments are required. It is probably more in tidying up the actual physical dimensions of the layers that make up the MEMS parts that move. It sounded like the FAB's processes didn't quite match the theoretical dimensions in the finished product. So I reckon that instead of changing their own specs they adjusted the FAB's processes slightly to give them dimensions that better matched what they needed - and had specified and theorised. That should work if they all understand the process well enough.