This is good news. However:
1. Functional does not necessarily mean working to any acceptable level of optimisation?
2. Testing is to continue for the majority of qtr. 1 at 4DS facilities? fair enough...but what about IMEC...what is the process?
3. Further learnings from testing results and analysis will be applied to refine the manufacturing process i.e. 4DS, and IMEC, already know its not completed.
3. Chip will be ready sometime in 2019....when...how many iterations....we need to understand the plan. If there is one?
The announcement would have benefited from a "next steps" paragraph. As it stands there is ambiguity around IMEC and their continued involvement. I believe the collaboration is ongoing but the announcement was too short and lacked clarity to be certain.
4DS Board is confident so we can take some comfort there at least.
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