Western Digital had already proven that memory cell works at 40nm. 4DS Memory would not be at imec unless they met some prerequisites.
imec has also proven that the memory cell works on Non-Plarfotm lots.
imec has also proven memory cell switching using an access device on the Second Platform Lot using the smallest geometries supported at imec (5nm).
The issue is with the etch mask template which is either a single layer problem or multiple layer problem out of say 100.
Yes it has taken longer than expected to get a Fully Qualified Megabit Chip. Who knows maybe one of the Platform 4 variants will be it.
Using the term broken is silly, 4DS is a development company and like any development company will go through multiple iterations until they come out with the product.
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