A question this brings to mind for me, that I haven't heard alot of talk about is around the form factor of the chip.
Surely integration of AKP's chip is going to be an issue for companies due to its form factor.
How could chips be used in mobile phones where space is of premium and surfaces are all flat/glass/metal.
Same goes for ipads etc.
TV's seem less problematic but the trend these days is for as thin a bezel as possible and adding a chip array to the front of the display or its sides is going to be an issue.
I know AKP talked about a protective film layer being added a while ago - but do these things work behind glass? And does anyone else worry about the form factor being a big limiter of applications?
Cheers and GLTAH
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