Updated the table based on the below source.
With regards to IP, can you provide the source that Rice University no longer own.
In relation to JEDEC Industry standard testing, table is not intended to compare test comparisons. 4DS Memory with imec may very well be following the same standards.
WBT "Embedded" Memory cell geometries being at 22nm is related to a taped-out demo chip / design / process, same reason why I did not mention "Stand Alone" Memory cell at 40nm for 4DS.
Table is comparing what has been Fab qualified.
4DS is not 6 years behind weebit, in actual fact based on the metrics weebit would be years behind now and possibly irrelevant.
Updated Table
I had highlighted Non-Filamentary to be superior to Filamentary due to the fact it is.
