Hey brother, not having a crack here but just thought to highlight what was and/or wasn't possibly known and what changed today. And I admit some of it is interpretive.. So agree other opinions may differ. One of those interpretations is based on the reasoning behind the process tweaking called out on 10 Dec & on the 20 Jan update and that the risk that is being mitigated by the next two runs is that of low yield and/or failure due to variable process factors.. Some of which were hopefully answered today and incorporated in the next run aiming at success..
"Further to the Company Update on 10 December 2020, 4DS and imec have agreed on the refinements to theprocess conditions for the Second Platform Lot wafers, which are expected to mitigate risks at various stages inthe fabrication process."
1-Feb-21
POSITIVE RESULTS FROM SECOND NON-PLATFORM LOT
• Data from the Second Non-Platform Lot demonstrated that the results from First Non-Platform Lot
were repeatableNot previously known
• Insights from the Second Non-Platform Lot were incorporated into process conditions for Second
Platform LotNot previously known and now a big postive for success at next iteration
• Production of the Second Platform Lot commenced at imec on 27 January 2021Not previously known
• Results from this Second Platform Lot are expected in Q2 of 2021Not previously known
BackgroundAllknown
On 24 June 2020, 4DS announced the results of its analysis of the Additional Wafers Lot (being the First NonPlatform Lot of 300mm wafers). The First Non-Platform Lot was fabricated with process condition contributions from Western Digital / IMEC There's that name again 
The 24 June 2020 announcement stated “it [4DS] has measured the highest speed and endurance in the
Additional Wafers Lot that have ever been recorded by the Company: No reported change as no need really
− The best recorded speed at near DRAM speed exceeds Storage Class Memory requirements without the
need for speed crippling error correction;Class leader in a 1 horse raceso why spend time & money here ?
− Endurance is two to three times better than previously reported. Actual endurance may be significantly higher
but is currently not quantified due to available lab time and test equipment capacity; andAgain above the threshold req so better spending money on reducing process risk &increasing yield..
− The Company also measured retention and the results remain confidential to the Company and its partners
until such time as the upper limits of retention can be more accurately defined.”Basically it's commercial in confidence and we aren't going to say
Second Non-Platform Lot
Further to the update provided in the Company’s Quarterly Activity Report dated 20 January 2021, 4DS confirms
that it has now completed its testing of the Second Non-Platform Lot. The Company is pleased to report that the
data from the Second Non-Platform Lot:
− Confirmed that the Company has been able to repeat the results for each of the key memory characteristics
(speed, endurance and retention) that were achieved with the First Non-Platform Lot;Not previously known but possibly assumed on announcement of successful manufacture
− significantly, 19 of the 21 device wafers were functional, a first for the Company (the two non functional wafers
were the result of being manufactured outside the imec process window); andNot previously known and a company first for successful manufacture (Either two failed or two were deliberately set outside parameters as a datum to measure the total change effect?)
− provides 4DS with further valuable insights with respect to how changes in key process parameters affect
these key memory characteristics; i.e. which changes increase which memory characteristic.Not previously known and a positive for mitigating process deviation or risk..
Benefitting memory both characteristics and possibly underpinning yield continuity factors perhaps as th next driving factor afterspeed and endurance?
Second Platform Lot
The learnings from the Second Non-Platform Lot have been incorporated into the process split conditions for the
Second Platform Lot of 300mm wafers. The Second Platform Lot is using imec’s memory platform, and contains
dense memory arrays with the control logic necessary to read and write selected bits and bytes.Previously suggested and now confirmed
The production of the Second Platform Lot commenced at imec in Belgium on 27 January 2021, and the Company
expects to analyse these wafers in Q2 of 2021.Not previously known and ballparks a deadline
The results from the analysis of the Second Platform Lot are expected to pave the way for 4DS and its partners
to pursue their strategic objective of fabricating wafers with chips that operate as fully functional megabit
memories, and which have been produced using state of the art industry fab equipment. If successful, this may
bring 4DS closer to its 2021 objectives to achieve a potential corporate transaction.Previousl ystated without the word "potentially" so possibly a bit of throw the scent happening here as Don't want to start the party early,
, however all iterations to date since the defining Lot 4have been successful and advancing at each iteration, by nature of the process..
4DS’ Managing Director, Dr Guido Arnout stated that “We are pleased that the success of the Second NonPlatform Lot has meant that we were able to immediately commence fabrication of the Second Platform Lot. We
are grateful to our partner, imec, for scheduling a slot in its state of the art fab in such a timely manner, particularly
given the high demand for access to fab equipment in the current semiconductor market environment.”
Drs. Wilbert van den Hoek, 4DS’ Chairman, commented “Industry players want to know that a new memory
technology can be produced commercially, using industry standard fab equipment. 4DS is well advanced on this
path, and the commencement of the Second Platform Lot is another significant step forward.”And finally the first endorsement, as not previously stated, by the guy who some say is in charge of selling it to silicon valley?
Again as I say others may differ in their opinion but I think it says a lot.. tbh, known or otherwise.... GLTAH 8tey
(20min delay)