i dont know, the 40nm chip/wafer were produced in LETI facilities.
so costs should be similar until the 28nm/300 integration is complete at leti (assume $1.1m a quarter in total expenses)
the 28nm/300mm wafers from what i can gather are going to be production fab qualified in a commercial foundry. Change in costs here are unknown to me.
id like to assume its at zero cost due to a cooperation agreement with whichever foundry WBT use but that might be hoping for too much.
Ann: Q3FY19 Activities Update and Appendix 4C, page-60
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