Ann: Quarterly Activities/Appendix 4C Cash Flow Report, page-399

Very interesting patent for obviously a development use for potential clients:

Here is further information of the patent:

A loudspeaker isa transducer device that converts electrical signals into acoustic signals.MEMS speakers (MicroElectroMechanicalSystem), that is, micro-electromechanicalsystem speakers, have the advantages of good consistency, low powerconsumption, small size, and low price compared with traditional voice coilspeakers. Usually, the chips in the MEMS speaker are stacked on the substrate,and this structure increases the overall height of the MEMS speaker, resultingin a larger volume of the MEMS speaker.

Contents of the invention

The object of the present invention is to provide a chip packaging structure, a loudspeaker and a chip packaging method, so as to optimize the chip packaging structure, reduce the stacking height of the chips, and reduce the overall volume of the packaging structure.

In order to achieve the above object, in a first aspect, the present invention provides a chip packaging structure, including:

a base plate, the base plate has a mounting groove;

a cover assembly, the cover assembly is connected with the substrate and encloses to form a cavity, and the installation groove is located in the cavity;

The first chip is located in the installation groove;

The second chip is located in the cavity. The second chip is composed of a first part and a second part. The first part is located on the part of the substrate where no installation groove is provided, and the second part is located on the first chip.

In the case of adopting the above technical solution, the substrate has a mounting groove, the first chip is located in the mounting groove, the first part of the second chip is located on the part of the substrate that is not provided with the mounting groove, and the second part is located on the first chip. structure, by embedding the first chip in the mounting groove of the substrate, the first part of the second chip is stacked on the substrate, and the second part is stacked on the first chip, so that when the chip is packaged, the first chip can be hidden and mounted on the In the mounting groove of the substrate, the overall stacking height of the substrate, the first chip and the second chip is reduced, thereby reducing the overall volume of the packaging structure.

In some possible implementation manners, there is an adhesive layer between the first chip and the second chip, and the first chip and the second chip are respectively bonded to the adhesive layer. With such arrangement, the stability of stacking the first chip and the second chip is improved.

In some possible implementation manners, the sum of the thickness of the first chip and the thickness of the adhesive layer is equal to the depth of the installation groove. Such an arrangement further improves the overall stability of the stack of the first chip and the second chip.

In some possible implementation manners, the first chip is an ASIC chip; and/or the second chip is a digital sounding chip. Such setting facilitates signal processing and transmission through the ASIC chip; facilitates sound generation through the digital sounding chip.