I believe point # 4 below explains the issue outlined above by BobF? There is only 1 sound chip. The other is the ASIC controller. EM seem to have a specific application in mind but certainly not mobile technology as they already have an ASIC in the unit which I assume would be used to drive the digital MEMS?
1. A chip packaging structure, characterized in that, comprising:
a base plate, the base plate has a mounting groove;
a cover assembly, the cover assembly is connected to the substrate and encloses to form a cavity, and the installation groove is located in the cavity;
the first chip is located in the installation groove;
The second chip is located in the cavity, the second chip is composed of a first part and a second part, the first part is located on a part of the substrate where the mounting groove is not provided, and the second part is located on on the first chip.
2. The chip packaging structure according to claim 1, wherein an adhesive layer is provided between the first chip and the second chip, and the first chip and the second chip are respectively connected to the Adhesive layer bonding.
3. The chip packaging structure according to claim 2, wherein the sum of the thickness of the first chip and the thickness of the adhesive layer is equal to the depth of the mounting groove.
4. The chip packaging structure according to claim 1, wherein the first chip is an ASIC chip; and/or the second chip is a digital sound chip.
5 . The chip packaging structure according to claim 1 , wherein the cross-sectional area of the first part is less than or equal to 1/4 of the cross-sectional area of the second chip.
6. The chip packaging structure according to any one of claims 1-5, wherein the cover assembly comprises a housing and a sound-permeable membrane, the housing is connected to the substrate and surrounds the cavity to form the cavity body, the casing has a perforation, and the sound-permeable membrane is located in the perforation.
7 . The chip packaging structure according to claim 6 , wherein, along a direction perpendicular to the surface of the first chip, the projection of the sound-transmitting membrane on the substrate is located at a middle position of the substrate. 8 .
8. The chip packaging structure according to any one of claims 1-5, wherein the first chip and the second chip are electrically connected through metal wires, and the first chip and/or the second chip The second chip is electrically connected to the substrate through a metal wire.
9. A loudspeaker, characterized in that it comprises the chip packaging structure according to any one of claims 1-8, the first chip in the chip packaging structure is an ASIC chip, and the second chip in the chip packaging structure The chip is a digital sound chip.
10. A chip packaging method, characterized in that using the chip packaging structure according to any one of claims 1-8, comprising:
Soldering the first chip in the mounting groove of the substrate;
laying an adhesive material on the surface of the first chip;
soldering a second chip on the substrate, and bonding the second chip portion to the first chip;
electrically connecting the first chip to the second chip through metal wires;
A cover assembly is installed on the substrate to package the first chip and the second chip.
Expand
(20min delay)