Just read this waffle…..way too funny. Just show it.
As had been extensively reported the complexity of MEMS demands an iterative development approach that models, evaluates, improves and aligns designs to fabrication capabilities based on actual test and measurement results. Some past reported examples of this iterative process included issues pertaining to charge dissipation, stiction, misalignment, sacrificial material release, process residues, wafer handling, and others. The objective of this massive undertaking was to establish a reliable, repeatable and stable fabrication process that will not only produce devices to spec, but to establish clear and precisely defined boundaries of realistic manufacturing capabilities (“process window” that dictate the device design (“design rules”.
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Ann: Quarterly Activities/Appendix 4C Cash Flow Report, page-6
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