Well they are certainly on the journey, 6 patents either lodged or granted. here is a new lodgement about sorting out the manufacturing issues:
App Number:
CN202311428132.X
File Date:
2023-10-31
Pub Number:
CN117177166A
Pub Date:
2023-12-05
Assignee:
Earth Mountain ( Suzhou ) Microelectronics Technology Co., Ltd.
Inventors:
Liu Changhua
Yuan Feiyang
Attorney/Agent:
Wang Shengli
Agency:
11628
IPC:
H04R 31/00
External links:
Espacenet ;
Global Dossier ;
Abstract
The invention discloses a digital speaker and a manufacturing method thereof, which relate to the technical field of microelectronics manufacturing and are used to solve the problem that when processing MEMS speakers, drive plates or diaphragms need to be formed one by one, which is time-consuming and has low processing and manufacturing efficiency. The manufacturing method of the digital speaker includes fixing a first electrode plate on the side of the substrate with an air back cavity; forming one or more drive plates on the first electrode plate; depositing a first dielectric layer on the first electrode plate; A second electrode plate is fixedly arranged on the side of the first dielectric layer away from the first electrode plate; multiple diaphragms are formed on the second electrode plate; adjacent diaphragms of the second electrode plate are filled with the second dielectric layer; A plurality of vibration gaps are formed on the first dielectric layer. The digital speaker is formed by the manufacturing method of the digital speaker proposed in the above technical solution. The digital speaker and its manufacturing method provided by the present invention are used to improve the processing and manufacturing efficiency of the digital speaker.
Claims
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1. A method of manufacturing a digital speaker, characterized by comprising the steps:
Multiple air back cavities are formed on the substrate;
A first electrode plate is fixedly arranged on the side of the substrate having the air back cavity;
forming one or more drive plates on the first electrode plate;
At least one through hole is opened on each of the driving plates, and each air back cavity is connected to at least one of the through holes;
Deposit a first dielectric layer on the first electrode plate;
A second electrode plate is fixedly provided on the side of the first dielectric layer away from the first electrode plate;
Form a plurality of diaphragms on the second electrode plate;
Filling the diaphragm adjacent to the second electrode plate with a second dielectric layer;
A plurality of vibration gaps are formed on the first dielectric layer, and each vibration gap is located between the corresponding diaphragm and the driving plate.
2. The manufacturing method of a digital speaker according to claim 1, wherein forming a plurality of driving plates on the first electrode plate includes:
A plurality of first short-circuit grooves extending along the first direction are etched on the first electrode plate. The plurality of first short-circuit grooves are arranged along the second direction. A plurality of first short-circuit grooves are formed between adjacent first short-circuit grooves. A driver plate corresponding to multiple air rear cavities;
Alternatively, forming a plurality of driving plates on the first electrode plate includes:
A plurality of first short-circuit grooves extending along the first direction are etched on the first electrode plate, and the plurality of first short-circuit grooves are arranged along the second direction;
A second short-circuit groove extending along the second direction is etched on the first electrode plate; wherein the first direction and the second direction are different, and the first short-circuit groove and the third short-circuit groove are Two short-circuit grooves divide the first electrode plate into a plurality of driving plates, and each of the driving plates corresponds to one or more of the air back cavities.
3. The manufacturing method of a digital speaker according to claim 1, wherein forming a plurality of diaphragms on the second electrode plate includes:
A plurality of third short-circuit grooves extending along the second direction are etched on the second electrode plate. The plurality of third short-circuit grooves are arranged along the first direction. A plurality of third short-circuit grooves are formed between adjacent third short-circuit grooves. A diaphragm corresponding to multiple air back cavities;
Alternatively, forming a plurality of diaphragms on the second electrode plate includes:
A plurality of third short-circuit grooves extending along the second direction are etched on the second electrode plate, and the plurality of third short-circuit grooves are arranged along the first direction;
A fourth short-circuit groove extending along the first direction is etched on the second electrode plate; wherein the first direction and the second direction are different, and the third short-circuit groove and the third short-circuit groove are Four short-circuit slots divide the second electrode plate into multiple diaphragms, and each diaphragm corresponds to one or more of the air back cavities.
4. The method of manufacturing a digital speaker according to claim 1, wherein after depositing a first dielectric layer on the first electrode plate, Before fixing the second electrode plate on one side, the manufacturing method of the digital speaker further includes:
A plurality of annular protrusions are formed on the side of the second electrode plate close to the first dielectric layer, and each of the annular protrusions corresponds to one of the air back chambers;
Fixing the second electrode plate on the side of the first dielectric layer away from the first electrode plate includes:
The annular protrusions are embedded in a side of the first dielectric layer away from the first electrode plate, and the plurality of annular protrusions separate the first dielectric layer into a mesh-like support dielectric structure and a plurality of The dielectric structure to be etched.
5. The manufacturing method of a digital speaker according to claim 1, wherein the depositing the first dielectric layer on the first electrode plate includes:
Deposit a mesh support dielectric structure on the first electrode plate, and the projection of the mesh support dielectric structure on the first electrode plate covers the edge area of each drive plate;
A dielectric structure to be etched is deposited at each hollow position of the mesh-like support dielectric structure, and the mesh-like support dielectric structure and the to-be-etched dielectric structure form a first dielectric layer, wherein the mesh-like support dielectric structure The material of the structure is different from that of the dielectric structure to be etched.
6. The manufacturing method of a digital speaker according to any one of claims 4 to 5, characterized in that after depositing a second dielectric layer on the second electrode plate, a plurality of Before vibrating the gap, the manufacturing method of the digital speaker further includes:
A cantilever pattern is formed on each of the diaphragms, and the cantilever patterns penetrate the diaphragm;
Forming a plurality of vibration gaps on the first dielectric layer, each vibration gap being located between the corresponding diaphragm and the drive plate includes:
The etching medium is brought into contact with the dielectric structure to be etched through the cantilever pattern, and the dielectric structure to be etched is etched to form the vibration gap.
7. The manufacturing method of a digital speaker according to any one of claims 4 to 5, characterized in that after forming a plurality of air back cavities on the base, the side of the base with the air back cavities is fixed. Before setting the first electrode plate, the manufacturing method of the digital speaker further includes:
A plurality of through holes are opened on the base, and each of the air back chambers is connected to at least one of the through holes;
Forming a plurality of vibration gaps on the first dielectric layer, each vibration gap being located between the corresponding diaphragm and the drive plate includes:
The etching medium is sequentially brought into contact with the dielectric structure to be etched through the through hole, the air back cavity and the through hole, and etches the dielectric structure to be etched to form a vibration gap.
8. The method of manufacturing a digital speaker according to claim 1, wherein after forming a plurality of vibration gaps on the first dielectric layer, the method of manufacturing a digital speaker further includes:
A plurality of pins PAD are formed around the first electrode plate and the second electrode plate, each driving plate is connected to the corresponding pin PAD, and each diaphragm is connected to the corresponding pin PAD. .
9. A digital speaker, characterized in that it is manufactured by the manufacturing method of a digital speaker according to any one of claims 1 to 8, and the digital speaker includes:
A base, with multiple air back chambers provided on one side of the base, and each of the air back chambers is connected to the outside atmosphere;
A plurality of drive boards, each drive board is fixedly disposed on the side of the base with the air rear cavity, and each drive board is provided with at least one through hole, each through hole is connected with the corresponding said air cavity. The air back cavity is connected;
A mesh support media structure, which is fixedly disposed on the side of the driving plate away from the base. A plurality of vibration gaps are formed in the middle of the mesh support media structure, and each vibration gap passes through the The perforations are connected with the corresponding air back chamber;
A plurality of diaphragms, each of which is disposed on a side of the mesh-like supporting medium structure away from the driving plate.
10. The digital speaker according to claim 9, characterized in that the digital speaker further includes a plurality of pins PAD, each of the diaphragms is connected to a corresponding pin PAD, and each driving board is connected to a corresponding pin. The pin PAD is connected.
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