Ann: Quarterly Activities/Appendix 4C Cash Flow Report, page-17

Qeegbill, the technical issues relate to the patents lodged im sure in June/July is what is being referred to. All about stress on chip and the removal of sacrificial layers to complete the upgrades to the chips. There is a vast array on commentary in the patents published (for public view). Obviously they only talk to improvement in output and improvement in manufacturing outcomes without specifying exacts as you can imagine they are trade secrets.

Some patents lodged in Beiging, some in sound valley. Depending on where they are resolving such issues across the 3 fabs.