Ann: Quarterly Activity Report & Appendix 4C, page-67

hi mate - hope you're well

reflow qual is one of the final stress tests of the chip profile data pack - a failure profile if you will to provide operational limitation benchmarks of a chip physically tested
theres a few of them - any sale will suffer discount on premium for any of these with no qual outcome - that was the point i was clumsily attempting to make - if you sell to an acquirer under these conditions and there is significant risk profile in the sale due to unmet benchmarks so the price will reflect that discount - plenty of road to travel yet imo

good read here mate
https://www.wevolver.com/article/reflow-soldering

as you say what do we really know