Most interesting.
The dead duck has started to paddle.
Sounds like the testing equipment has gone from " should we" to "thank god we did"
My line of thinking is, that dead duck from last year spun everyone out, and I am sure there would have been ass kicking so to speak.
This backward step, would have created a greater urgency to detail. The intricate focus on the etching, so it didn't happen again, and, would have been an order of magnitude better detailed to make sure the i's were dotted and the t's crossed. Quality assurance would have been extra diligent.
The timing is beneficial. With the focus on etch optimisation, and now coinciding with the Imec's side of the manufacturing, the additional info from the new testing capabilities, will greatly enhance the outcome we desire.
It actually could jump us further ahead in the PCMO process of success and metrics. Onwards and upwards.
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