Excellent post BobF. Summarises the position clearly as far as we are able to understand from given information. One issue which I would like to add which you may care to clarify however. I understand EM are responsible for physically doing the packaging part of the manufacturing process? This is EM proprietary process which they have protected by patents under AKP guidance. We have been told this IP is protected between AKP and EM with a written agreement.
We then have the question of AKP's secret sauce, presumably installed in the ASIC software?
Like yourself and others on this forum I am waiting (im) patiently to read reports of the results of independent testing of the AKP Gen II MEMS. Only then will we be able to compare performance with other so called competitor products.
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