AKP is packaging MEMs not cans of pumpkin soup. Each MEM's device is unique AKP and their packager must develop a process to package the chip while also maintaining it's electrical and mechanical properties. Each packaging iteration they will learn more and refine the process. AKP saying only one or two additional iterations (test runs) before final chip packaging means they are very close.
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- Ann: Supplementary Information to Appendix 4C for 31 March 2021
Ann: Supplementary Information to Appendix 4C for 31 March 2021, page-24
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