Not sure where you are getting failure on the ( last 2 device lots from). But when you are cutting edge and no one is doing the same thing, there is bound to be items that need addressing. As for the test equipment, I don't think it has to do with them knowing the results of wafers stacking , as this has been mentioned for over 6 months that the test equipment is what is hindering the results. Has been awhile coming that the test equipment needed altering/upgrading to test their upper limits.
Ann: Testing Capability Upgrade & Management Changes, page-80
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