Ann: Trading Halt, page-114

Yes I like the sound of them using the new test equipment to retest the old chips. They have always referred to the technical issue with platform lot 2 (PL2) being a "potentially modest degradation". The key word being "potentially", which (correct me if I'm wrong) is the whole reason for the new etch mask. Maybe they've retested the old chips to see whether that was a real thing or not using their flash new test equipment.

If it turns out that there wasn't actually any degradation, then this would mean the old mask was perfectly fine in PL2. That might also mean that if they're having issues engineering the the new etc mask, then they could ditch the new mask and revert back to the old mask without any issues. Pure speculation, but that's another take on "technical update 2.0".