4DS 0.00% 7.9¢ 4ds memory limited

27 February 2023 RENEWED TECHNICAL PROGRESS UPDATE 4DS Memory...

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    27 February 2023 RENEWED TECHNICAL PROGRESS UPDATE 4DS Memory Limited (ASX:4DS) (4DS) (the Company), is pleased to provide shareholders with information regarding renewed technical progress. In an ASX announcement released on 5 October 2022, 4DS stated that the etch process had induced damage to the crystallinity of the 4DS PCMO layer resulting in the write voltage needed to program the cell exceeding the write voltage that the circuitry of the imec megabit memory array could provide. Since prior wafers had shown successful programming of cells of the same size as present in the megabit memory array, the focus would be on further optimizing the etch process to ensure both residue-free etching and no crystalline damage to the 4DS PCMO layer. In the same ASX announcement, 4DS stated that the goal of the next Platform Lot remained the demonstration of the cell operation in a megabit memory array environment and to explore optimized programming conditions to improve both the endurance and retention of 4DS Interface Switching ReRAM cells. Access to the write circuitry of the megabit memory array remains critical to achieve these goals. Since that ASX announcement on 5 October 2022, 4DS has undertaken a number of optimization changes which are currently being incorporated into the schedule for manufacturing of the Fourth Platform Lot at imec. During the same period the Company has significantly enhanced its test capabilities and re-tested the Third Platform Lot in preparation for the Fourth Platform Lot. The Company is pleased to report that it has now achieved cell operation in the megabit memory array of the Third Platform Lot utilising the improved test capabilities. This allows further exploration of optimized programming conditions with the access transistors and write circuitry of imec’s megabit memory platform. These results indicate that the 4DS Interface Switching ReRAM cells are potentially more likely to be compatible with imec’s megabit memory platform which de-risks the testing of the Fourth Platform Lot expected to be received by 4DS in late Q2 2023 as previously guided. Interim Executive Chairman Mr David McAuliffe commented “I would like to thank all the USA based 4DS management team and imec for the significant effort they continue to display in trying to achieve an important outcome for 4DS with the manufacture of the Fourth Platform Lot and potential successful analysis of the
 
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