Thought I would pull together the announcements relating to the...

Thought I would pull together the announcements relating to the development of Akida System on a Chip by Socionext. I have every respect for those who still are nervous about whether Akida System on a Chip will pop out of TSMC on time but in my opinion if you look through these announcements it seems to me:

A. That Socionext has done all the necessary due diligence and having done that due diligence offered a Turn-key ASIC service,

B. That Socionext having worked on the Akida design files has determined in advance of the actual chip being produced by TSMC to make a joint announcement that they will be offering a platform including the Akida system on a chip,

C. That in making this announcement Mr. Noriaki Kudo Corporate Executive Vice President of Socionext has stated they have successfully collaborated on the Akida IC development and that they aim to commercialize the entire product family to their customer base.

D. That Socionext has delivered the Akida design files to TSMC so that wafer fabrication can

commence on 8.4.20 not on 3nm, 5nm or 7nm but on tried and tested 28nm using tried and tested digital technology.

Can one really have any realistic fear that the Akida System on a Chip will not pop out of TSMC as Socionext obviously believes it will early in the third quarter. Of course do your own research.

First Announcement:

Sydney, Australia – 14 March, 2019: BrainChip Holdings Ltd (ASX: BRN), the leading neuromorphic computing company, today announced the execution of a Memorandum of Understanding (MoU) with Socionext America Inc. for the development of the AkidaTM Neuromorphic System-on-Chip (NSoC).

Anil Mankar, BrainChip Chief Development Officer commented, “After a great deal of investigation and diligence, it is clear that Socionext has the commitment, competency, intellectual property and desire to work with us on the implementation and launch of Akida. This is a complex design that requires close collaboration with our design and manufacturing partner. Socionext is a leader in the ASIC market and has specific domain competency in image processing. We are proud to announce this memorandum of understanding and look forward to working with Socionext to complete the design and introduce Akida.”

Second Announcement:

Sydney, Australia – 26 June 2019: BrainChip Holdings Ltd (ASX: BRN), the leading AI Edge company, today announced the signing of a definitive agreement with Socionext America Inc (SNA) for product development and manufacturing of its Akida Neuromorphic System-on-Chip (NSoC).

Socionext will provide turn-key ASIC services toBrainChip for the Akida product, including intellectual property (IP) blocksfor the external interfaces, the CPU Complex for internal control and datapre-processing, place and route of the integrated circuit, IP verification,final logic design, as well as managing wafer fabrication, assembly and testoperations. Wafers will be provided by Taiwan Semiconductor Manufacturing Company Ltd (TSMC), a world leader in semiconductor technology and wafer fabrication on its competitive and cost effective 28nm CMOS logic process. “We are excited to join BrainChip in the design, development and introduction of Akida” said Noriaki Kubo, Corporate Executive Vice President of Socionext. “Bringing artificial intelligence to edge applications is a major industry development and a strategic application segment for Socionext. Socionext provides suppliers such as BrainChip with a large engineering solutions platform, ranging from integrated circuit design through final test and assembly, to bring high quality products to market efficiently.”

Third Announcement:

Aliso Viejo, California – 22 March 2020 – BrainChip Holdings Ltd (ASX: BRN), a leading provider of ultra-low power high performance AI technology today announced that Socionext Inc., a leader in advanced SoC solutions for video and imaging systems, will offer customers an Artificial Intelligence Platform that includes the Akida SoC, an ultra-low power high performance AI technology.

Socionext has played an important role in the implementation of BrainChip’s Akida IC, which required the engineering teams from both companies to work in concert. BrainChip’s AI technology provides a complete ultra-low power AI Edge Network for vision, audio, and smart transducers without the need for a host processor or external memory. The need for AI in edge computing is growing, and Socionext and BrainChip plan to work together in expanding this business in the global market.

“As a leading provider of ASICs worldwide, we are pleased to offer our customers advanced technologies driving new innovations,” said Noriaki Kubo, Corporate Executive Vice President of Socionext Inc. “The Akida family of products allows us to stay at the forefront of the burgeoning AI market. BrainChip and Socionext have successfully collaborated on the Akida IC development and together, we aim to commercialize this product family and support our increasingly diverse customer base.”

Forth Announcement:

BrainChip Holdings Ltd Market and Product Development Update 25 March 2020 6:00 p.m. USPDT 26 March 12:00 p.m. 2020 AEDT 26 March 9:00 a.m. AWST

AkidaTM Update Sales and Markets • Socionext to offer BrainChip AkidaTM device with SynQuacerTM multicore processor • Reference design for OEM/ODM edge server requirements

Latest Announcement:

Company Announces Wafer Fabrication of the AkidaTM System-on-Chip _____________________________________________________________________________ • BrainChip and Socionext have delivered the Akida design files to Taiwan Semiconductor Manufacturing Company (TSMC) for manufacturing • TSMC Multi-Project Wafer (MPW) and Shuttle reduces the fabrication expenses and provides faster delivery of engineering samples • MPW at TSMC is scheduled to commence on 8 April 2020 • Engineering samples will support the the validation of the Akida Intellectual Property (IP) for ASIC delvopment and hardware designs in conjunction with the Akida Development Environment (ADE) for integration of BrainChip’s IP or device into commercial AI applications ______________________________________________________________________________ Aliso Viejo, California – 7 April 2020 – BrainChip Holdings Ltd (ASX: BRN), a leading provider of ultra-low power, high performance AI technology announced that the Company and Socionext Inc., it’s development, manufacturing andcommercial partner, have provided its wafer fabrication partner, TSMC, with thecompleted Akida design files and the MultiProject Wafer (MPW) is scheduled tocommence fabrication on 8 April 2020. Given the accelerated processing time forMPW wafers, engineering samples of the Akida device are expected to beavailable in the third quarter of 2020.