would anyone have an idea of what an early investment agreement would amount too.
really like the tmt interviews and when mixed with the other earlier interviews i think we could say we are at 40nm layered or 3 dimensionally, and more than likely at 28 or 2x. it appears the hurdle of shaping the edges has been overcome with what appears to be sfa redundancy early stages.
considering the map to commercialise i see leading room for agreements here. Also see these option conversions as a bug bear, however surley one would keep some order to the technicals one would think, to delevarage into.
anyway, embedded is the first path as it feeds other periphials next in line (from my laymens understanding, usb 5.0, ddr6 etc. yes/no?)
interesting.
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