Ann: Weebit Nano Q3 FY22 Activities Report and Appendix 4C, page-30

From the announcement on 15th July 2021.
"The ReRAM module was designed in the ST 130nm process after interaction with potential customers showed it is the sweet spot for their analog, power, sensor and IoT designs. It includes a 128Kb ReRAM array, control logic, decoders, IOs (Input/Output communication elements) and error correcting code."

"Weebit expects to have its first silicon of the embedded ReRAM module towards the end of this year. The Company plans to demonstrate the module and report functional testing results in the first quarter of 2022. Qualification of the module is expected by mid-2022."

Explanation of technical terms
• Tape-out: The final phase of the chip design process in which the design is released tomanufacturing.
• System-on-Chip: As the size of digital elements shrinks, it is common to put a full system, including processor, communication, memory and other dedicated elements on a single piece of silicon.
• Qualification: The process in which the fab ensures that a design is ready for mass productionand complies with its specifications. This includes ensuring that it is stable, operates reliably as designed and meets yield targets and quality standards.

I understand what you are saying however I disagree. Why has Coby stressed that qualification of 130nm at Skywater is so important to WBT. 130nm was the sweet spot for potential customers, fantastic for WBT as it was the easiest to qualify and mass produce as per the above under Qualification heading which specifically states MASS production.
Of course the 130nm node isn't going to be in every product but ReRam qualification for mass production has never been achieved at any fab at any node. Once qualification at 130nm is successful it opens the door to the lowest nodes which in turn leads to ReRam in every device. 130nm though as per @comincon post above is a very lucrative node and produced at many many fabs.
WBT has however already successfully scaled down to 28nm. 22nm and lower will be coming as Coby has confirmed WBT and Leti have a clear path to achieve these advanced nodes. As per your comments WBT ReRam has no competition below 40nm. Obviously that is because Flash can't scale below that without major hurdles to jump. To say fabs will want 22nm because they will want a competitive edge over fabs unable to produce at those smaller nodes completely misses the disruptive advantage of ReRam at every node. No fab that stays with Flash will be able to compete with ReRam at any node. This is a Super Disruption. Why, disruptions happen with 10X improvement over old tech. WBT ReRam is 100X and up to 1000X better.
As stated in the above announcement and confirmed today, characterisation and qualification of the demo chips is right on track and should be with potential customers by mid year. So first mass produced products with 130nm ReRam could hit the market 18months after that. Those early adopters will be champing at the bit to try this brand new memory module out. As @Cguv says not long to find out the "WHO".
So to summarise the most important node is 130nm because after that is successful at mass production every other node is now possible for WBT with a path and work underway to scale down to these nodes.
While 22nm may prove more important than 130nm and open up markets that aren't even there atm, 130nm will remain one of the most popular and lucrative nodes going forward.